ceramic housing for semiconductor, thyristor and diode, passed ISO9001 ISO14001 OHSAS 18001. Export to Germany,Britain OEM Quality products are SAIYING keys to our sustainable growth over the years. Even in the rapidly changing world like today, our priority and commitment to product quality have been steadfastly maintained.

Main material:

Ceramic parts:≥93.5%Al2O3

Glaze:Color white or pink, T≥1,450°

Flange:TU1 (OFHC Cu) or Ni42Fe58alloy

Copper contact: TU1 (OFHC Cu)

Solder: Ag72Cu28alloy

Gate tube: TU1 (OFHC Cu) or Ni42Fe58alloy

Technical specifications:

The all products can reach to the below standards

Leak rate:≤1×10-8 bar cm3/ sec with helium

Flatness of copper surface: ≤0.008 mm

Parallelism between copper surfaces≤0.03 mm

Concentricity between flange and copper: ≤0.5 mm

Pull test: ≥5Kn/cm2

Temperature cycling:-65°-200°,5 circles

Nickel plating thickness:2-7um

Ceramic Packages for Power semiconductor parts