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Ceramic Dics for Semiconductor Part
Ceramic Dics for Semiconductor Part
Supplier Info
[China Supplier]
Contact Person : Mr. Guoxian Chen
Tel : 86-510-86275037, 86-13961693204
Fax : 86-510-86276840
Product Detail
Our products have passed ISO 9001 ,ISO 14001 and ISO18001 Export to Germany, Britain, India,and so on. OEM serive.

Main material:

Ceramic parts:≥93.5%Al2O3

Glaze:Color white or pink, T≥1,450°

Flange:TU1 (OFHC Cu) or Ni42Fe58alloy

Copper contact: TU1 (OFHC Cu)

Solder: Ag72Cu28alloy

Gate tube: TU1 (OFHC Cu) or Ni42Fe58alloy

Technical specifications:

The all products can reach to the below standards

Leak rate:≤1×10-8 bar cm3/ sec with helium

Flatness of copper surface: ≤0.008 mm

Parallelism between copper surfaces≤0.03 mm

Concentricity between flange and copper: ≤0.5 mm

Pull test: ≥5Kn/cm2

Temperature cycling:-65°-200°,5 circles

Nickel plating thickness:2-7um

Ceramic Dics for Semiconductor Part

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