1.Layers 6 layers 2.Surface finish Immersion Gold 3.Line/Space 4/4mil 4.pcb design

Surface processing type	HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin /immersion siler
Layers	single-sided,double-sided,multilayer pcb board
Min trace width	6mil
Min space width	3mil
Min trace to pad/pad to pad space	6mil
Min drill diameter	8mil
Min via pad	24mil
Max board size	Single and double sides:550mmX1100mm;multilayer:550mmX640mm
Min solder mask dam	6mil
Min solder mask clearance	1.5mil
Min solder mask thickness	10um
Solder mask type	Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue.
Min silk legend width	6mil
Min silk legend height	25mil
Silk legend color	White/ yellow /black
Data file format	GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series,ODB++
Electricity performance testing	100% electrical performance testing,high pressure testing
Power Various types base material to PCB processing	High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3)
Other testing request	Impendence testing, Hole resistance testing, gold slice up, Solder ability.

Electronic Multilayer PCB Board with pcb design