Welcome to ECOL - Join Free - Sign In
2012 single crystal bare copper welding wire bonding
2012 single crystal bare copper welding wire bonding
Supplier Info
[China Supplier]
Contact Person : Ms. Yang Amanda
Tel : 86-577-55775868 55775869
Fax : 86-577-55775833
Product Detail
1. Copper welding wire 2. High quality 3. Good price 4. Advanced tech manufacture 5. Certification: ISO,ROHS,MSDS,Reach

   

Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for key materials of semiconductor packaging( molding compound, solder ball, high-desity packaging substrate, conducting resin).

Features of products:

 1. material costs: low

 2. electronical conductivity: 5.88 10E7/Ohm

 3. thermal conductivity: 39.5KW/m2k 

 4. mechanical properties: good

 5. stability: stable

 6. solder joint: relatively better

Diameter(mm)

0.0180.0200.0230.0250.0280.0300.0320.0330.0380.050

special order avaliable

Copper Wire Physical Properties:

Resistivity

1.690*10-6 Ω.cm

Density

8.9g/cm3

Purity

5N

Pull(Φ25μm)

>7cN

Arc height

8mil

Fusing current

Same as usual copper bonding wire

Copper Bonding Wire Advantage:

1. Material costs: Low

2. Conductivity: 5.88 10 E7/Ohm Much thinner bonding wires during fine pitch packaging,  

                         excellent performance of fine pitch(much smaller bonding pad), improving  

                         current capacity and property of power regulating device.

3. Thermal conductivity: 39.5 KW/m2K

4. Mechanical properties: High mechanical property, larger tensile strength, better elongation,  

                                         excellent ball collar strength and higher arc stability.

5. Stability: Stable-slow inter-metallic growth rate, improving mechanical stability  

                   and decreasing incremental resistance: moderate IMC growth enables  

                   bonding strength to be improved.

6. Solder joint: Significantly reduced inter-metallic growth rate of solder joints. Resistance  

                        reduced, heat production decreased, bonding reliability and device performance  

                        improved. As the new products have their inter-metallic growth rate, resistance  

                        and heat production lower than gold wire, the amount of resistance increase with  

                        time and aging rete also is reduced.  

Double flange spool:

           

Spool 

type

Material

Flange 

diameter

Core 

diameter 

Wall 

thickness

Internal 

diameter 

Overall 

width

Width over windings

AL-2

Aluminum

 mm

 mm

 mm

 mm

 mm

 mm

 Φ58.5±1.0

 Φ50.3±0.01

 Φ0.75±0.1

Φ48.8±0.2

 Φ28±0.5

Φ26.5±0.5

AL-4

 Φ58.5±1.0

 Φ50.3±0.01

 Φ0.75±0.1

Φ48.8±0.2

Φ47.3±0.5

Φ45.5±0.5

Ads by Google

Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0-9
Copyright Notice @ 2008-2022 ECOL Limited and/or its subsidiaries and licensors. All rights reserved.