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Sn-3.0Ag-0.5Cu-Ce lead free solder paste:
Model NO. ZXRM401P
Melting point: 216-221oC
Spec gravity: 4.5-5.0
Flash Point: ≥300oC
Characteristics:
Printing characteristic: good solderability even at peak temperature Usage: if the solder paste is taken out of the refrigerator, it must be placed at an environment of 25 for about 4 hours so as to make its temperature return to indoor one before any scraping, shoveling, stirring etc. Otherwise, the cold solder paste may be damped, causing tin balls. Printing conditions: As it is non-hydrophilic, the solder paste should be used at indoor temperature or under an environment of relatively high humidity, the maximum of which could reach 80%.Lead-free Solder Paste (Sn-3.0Ag-0.5Cu-Ce)