Thermal conductive pad K2500 ,2.50w/m-k excellent thermal conductivity, soft, V-0 Fire resistance, RoHs compliance.

K Series Thermal Gap Filler

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K2500 thermal gap filler

K2500silicone rubber thermal gap filler is a kind of silicon rubber-based gap filling material which is highly compressed withhigh heat-conducting filling materials. The coefficient of heat conductivity can reach 2.50 W/m.K. This kind of materials is aiming at offering superb heat-conducting property and maintains the cost efficiency of customers as well. The self-adhesion of K2500 enables them to stick on heating interfaces without back adhesives or binders. Apply K2500 heat-conducting silica sheets with appropriate thickness to the gaps between heating interfaces and their components according to the different sizes of the heating interfaces and gaps to form seamless connections between the heating interfaces and related components.

 

K2500thermal gap filler product data

Test Project	K2500 Test Results	Units	Tolerance	Test Method
Color	Light blue	/	/	Visual
Thickness	0.50 to 15.00 / 0.02 to 0.59	mm/ inch	±10%	ASTM D374
Specifications	200*400 / 7.87*15.75	mm/ inch	±5.00	ASTM D374
Specific Gravity	2.38	g/cm³	±0.20	ASTMD792
Hardness	35.00	Shore 00	±5.00	ASTM D2240
Voltage Endurance	≥3.00	KV/mm	±0.30	ASTM D149
Elongation	0.45	%	±0.20	ASTM D412
Tensile strength	2.30	Kgf/cm²	±0.50	ASTM D412
Temperature range	-40.00 to 200.00	ºC	/	EN 344
Thermal conductivity	2.50	w/m.k	±0.40	ASTM D5470
UL Flammability Rating	V0	/	/	UL94
ROHS Compliance	YES	/	/	ROHS

 

physical properties:

1. Precise dimensional stability, Excellent electrical insulation

2. Product self-adhesion, you can choose different colors

3. Common specifications: 200mm * 400 mm(7.8740"*15.7480")

4. non-toxic substances, in line with ROHS requirements

 

Application:

1. UPS power supply and inverter power sources Applications

2 .DVD, VCD heating interfaces;

3. High and low power LEDs;

4. High and low power heating units.

K2500 thermal conductive pad for LED/CPU/LCD