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Properties and Characteristics:
| Type | W (wt%) | Ti (wt%) | Purity (wt%) | Density (%) | Grain size (μm) | Dimension (max.mm) | Ra |
| WSi10 | 90±0.5 | 10±0.5 | 99.9-99.999 | ≥99 | <10 | Ø400×40 | ≤1.6 |
| WSi20 | 80±0.5 | 20±0.5 | 99.9-99.995 | ≥99 | <10 | Ø400×40 | ≤1.6 |
Applications:
Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.
W-Si Sputtering Target