Precision CNC Dicing / Cutting Saw with Digital Controller and Complete Accessories - SYJ-800 SYJ-800 is a CE certified dicing saw designed for dicing and cutting almost all kinds of materials up to 8" diameter wafer or 8" L x 8" W x 1" H components at low cost. The SYJ-800 saw can be programed by controll panel  with position accuracy of 0.01 mm or better. The sample stage with two-angle adjustmentallows customers to cut materials at the desired angle with +/- 0.5° tolerance.  It is an excellent tool for dicing  Al2O3 ceramic sheet and Si or Ge wafer for electronic substrate and solar power panel. 

SPECIFICATIONS Voltage AC 110V  (If using AC 220V 50/60Hz please contact us)  Motor 1/2 HP high torque DC motor (110V) with  selectable speed: 0-1400 or 0-3000.RPM  Effective Cutting Range Three  dimension:   X-axis: 8"      Y-axis:8"        Z-axis: 2" ( depth ) Accuracy 0.0025 mm moving resolution and 0.01 mm position accuracy. Cutting Blades Kits Two diamond blade is included: One 4" dia x 0.35mm (thickness) x 0.5" arbor  fully sintered diamond blade Two 4" dia x 0.35mm (thickness) x 0.5" arbor edge sintered diamond blades   Control mode Manual control /  Automatic digital control from control box Sample stage and Holder One 8" diameter flate sample holder and 8" vacuum chunck are included( wafer glue on 8" holder, then the holder is soaked by vacuum chunck Water Cooling Assemblies of water jetting, draining, and splashing protection are included. Net WT& DIMEN Net Weight: 50 kg Shipping WT & DIMEN Shipping weight : 150 lbs  Warranty One year limited --- including all electronic and mechanical parts, but not including damages caused by misuse, such as rusted part from inadequate storage and broken parts by the user.

Precision CNC Dicing / Cutting Saw with Digital Controller and Complete Accessories - SYJ-800