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PCBA assembly supplier pcb with components
1. Our professional engineering team can put your project into production in a short time. Sample pictures and BOM are needed to make customized products.Also we can supply for the copy of the PCB and PCBA ,so you just sent me the enquiry is ok ,we can do what you need to do !
2. We can supply CAD and Pro-E designed precision moulds. Moulds can be designed and manufactured according to customers' requests or samples. Plastic injection processing available.
3.buy the electronic components for you to the production of the PCBA
4. We have advanced equipment for through-hole and SMT DIP COB cable Assembly
5. ROHS compliant and lead-free process.
6. In-circuit, functional tests& burn-in tests, full system test
7. High output to guarantee prompt delivery.
Surface Mount Assembly
Each assembly is profiled thermally prior to production; ensuring the reflow process adheres to both solder manufacturer and customer’s specifications.
We are capable of placing a wide range of standard and odd-form SMDs, from the smallest 0201 devices through CSPs, μBGAs, flip-chips and other components up to 38 mm x 38 mm, including 0.5 mm (20 mil) fine-pitch BGAs. Maximum PCB size is 1200mm * 240mme.g. LED Tube,LED Bar.
Pin Through Hole
Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces per hour with an accuracy of 99% minimizing component loss.
Chip on Board Our COB packaging product line was put into production in October of 2004. Hongtai imported 12 sets of ASM-AB530 automatic ultrasonic & golden ball wire bonders, & automatic high precise die attaching machines which under our strict quality control, are used in our advanced clean room. serving hundreds of companies with high - quality COB packaging services, and bonding products such as remote control devices, keyboards, mice, MP3’s, smartcards, flash memory, medical equipments and more. We can produce 2000K COB packages monthly .
Board and System Level Testing
AOI Testing
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
·BGAs
·Micro BGAs
·Chip scale packages
·Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
·Power-up Test
·Advanced Function Test
·Flash Device Programming
·Functional testing