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Feature:.Improve mounting density of components on PC board.
Reflow solderable.
Contacts are completely sealed,enhancing reliability.
Packaged with a 12mm wide embossed taping.
Applications:For operating various mobile devices.
For operating various devices that require high density mounting suc as mobile phones,communication.
| Rating | 50mA. 12V DC | Operating temperature range | -30°C+85°C |
| Insulation resistance | 100Ω min.100V DC | Lifetime | 100,000Cycles min |
| Dielectric strenght | 250V AC for 1 min | Opearating force | B:180gf C:250gf |
| Contact resistance | 50mΩ | Travel | 0.15±0.05mm |