... layer to 24 layer Laminate material: FLEX Polyimide (Kapton) 0.0125mm to 0.125mm Laminate material: RIGID FR4, FR5, BT Resin, Teflon ... x 24") Copper thickness 0.5oz, 1oz Adhesive Thermal Bonding Sheet: 0.025mm(1mil) min Epoxy sheet: 0.075mm(3mil)min Finished board ... 0.2mm Minimum Track Width 0.1mm (4Mil) Minimum Track gap 0.075mm (3Mil) Min inner layer thickness 0.075mm (3Mil) Minimum SMD pad pitch 0 ...