Purity is 4N, Sputtering Targets Shape can be Discs, Rectangle, Plates, Sheets, Tube, Foils, Rods, Taper, Ring. Back metallisation up to 1600 x 1000mm;Metallic and non-metallic bond coverage >98%Ultrasonic c-scan on bond integritySputtering Targets Shape and Size: Discs, Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, Custom-Made. Disk targets, column targets, step wafer ...