HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001 ... &competitive price HDI PCB with BGA, Blind and Buried via, Made of FR4 Material1.Base Material:fr42.copper thickness: ... Soldermask Clearance (b)0.005" (0.125mm)Min SMT Pad spacing (c)0.004" (0.1mm)Solder Mask Thickness0.0007 ... authenticationcompany profile HDI PCB with BGA, Blind and Buried via, Made of FR4 Material