... NO Item Craft Capacity1 Layer 1-30 Layers 2Base Material for PCBFR4, CEM-1, TACONIC, Aluminium, High Tg ... mm9Min bonding pad diameter10mil10Max proportion of drilling hole and board thickness1:12.511Minimum linewidth of Idents4mil12Min Height ... testImpedanceTesting,Resistance Testing, Microsection etc.,19Date file formatGERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ...