... becomes bigger from center to edge, so make heat spread on BGA chip uniformly.5. Due to the particularity of ... Parameter: ModelChinafix CF 360Solder TypeLeaded Solder/Lead freeSMD TypeMicro bga,BGA,CSP,QFPPCB Thickness0.5mm~4mmPCB SizeW50mm*D50mm~W455*D350mmHeating Mode ... soldering. According to our statistics, only 30% clients can directly use our scheduled curve without any regulation. The room ...