HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001,CE,IPC ... quality&competitive price HDI PCB with BGA, Blind and Buried via, Made of FR4 Material1.Base Material:fr42.copper thickness:2oz3. ... .004" (0.1mm)Solder Mask Thickness0.0007" (0.018mm)Hole size0.01" (0.25mm)-- 0.257" (6.5mm ... )Hole Size Tol (+/-)± 0.003" (± 0.0762mm)Aspect Ratio6: 1Hole ...