1.bga chip rework equipment
2.Competitive Price with high quality
3.Accuracy control
4.Imported Sensor
Main Features of BGA Machine RM-5360
| Category | Items | Specifications |
| Temperature control system | The Number of Heater | 3 independent heaters, top heater, bottom heater, IR heater |
| The Power of Heater | Power of top heater: 800WPower of bottom heater: 800WPower of IR heater: 2700W |
| Heating Method | The 1st and 2nd hot-air heaters, no requires an external source of air, the Speed of fan is controlled by software. |
| Temperaturecontrol algorithm | High-precision K-type thermocouple with close-loop control, PID auto-tuning system temperature system. |
| Temperaturecontrol accuracy | ±1°C |
| The number of temperature curve | Magnanimity |
| analysis oftemperature curve | Supportautomatic analysis of the result of temperature curve |
| The number of externaltemperature testinterfaces | 2(Extensible) |
| Size of PCB and BGA | Size of PCB | Max 420X400mm ,Min 10X10mm |
| Size of BGA | 2X2mm—80X80mm |
| The scheme of clamping PCB | V-groove, PCB support, rapid positioning, convenience, accuracy, can fit for all kinds of PCB. |
| The Method ofsuck BGA | The build in vacuum pump can automatically suck BGA chip |
| Control system | Control mode | Color touch screen and intelligent industrial control module |
| Control interface | Humanized multifunctional operation interface based on Windows |
| Process control | Intelligent control of the process of welding and desoldering, automatic welding and desoldering |
| Others | Dimensions | 600x600x780mm |
| Weight | 55Kg |
| Power supply | AC220V±10% 50/60Hz 4400W |
