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information :
The parameters of LY IR6000 BGA Rework Station | ||||||||||
Basic Parameters | ||||||||||
Heating: IR | ||||||||||
Dimension: L 475mm×W480mm×H420 mm | ||||||||||
Weight: 19kg | ||||||||||
Total weight: About 21 kg, vary with the differen need of the users | ||||||||||
Electrical Parameters | ||||||||||
Power: 220VAC | ||||||||||
Upper Heating: IR | ||||||||||
Size of Upper heating: 80mm×80 mm | ||||||||||
Consumption of upper heating: 450W | ||||||||||
Bottom Heating: IR | ||||||||||
Size of Bottom heating: 180 mm×180 mm | ||||||||||
Consumption of Bottom heating: 800W | ||||||||||
General power: 1250W | ||||||||||
Temperature Control | ||||||||||
Control mode of Upper: Independent temperature control, high-precision closed-loop control, precision ± 0.5%, Alarm | ||||||||||
Control mode of Bottom: Independent temperature control, high-precision closed-loop control, precision ± 0.5%, NO Alarm | ||||||||||
Rework Function | ||||||||||
SMD: Suit for welding, remove or repair packaged devices such as BGA, PBGA,CSP,multi-layer substrates, EMI metallic shield product and solder/lead free Rework ,welding | ||||||||||
Size of applicable chips: ≤70mm×70 mm | ||||||||||
Size of applicable PCB: ≤400mm×305 mm |