Item

Technology Parameters

Material

FR4,High Tg FR4, High CTI FR4,Halogen Free material, Rogers HF material, Aluminum based ect.

Layer

1~10layers

Finished Copper Thickness

0.5~6oz

Finished Board Thickness

0.2~6.0mm

Min. Line/Track Space

3mil

Min. Line/Track Width

3mil

Min. Contour Tolerance

+/-0.1mm

Min.Finished hole size(PTH)

0.1mm

Max. Aspect Ratio

12:1

Min. Solder Mask Bridge

3mil

Min. Legend Track width

5mil

Min. Legend Height

30mil

Solder mask color

Green, black, blue. white, yellow, purple and matte, ect

Legend/silkscreen color

White, yellow, black, ect

Surface treatment

HAL, lead free HAL, immersion gold, OSP, immersion tin ect

Other technology

Gold finger, peelable mask, Non-across blind and buried vias, characteristic impedance control ,Rigid-flex board ect.

Reliability test

Open and short test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis ,etc.

Wrap and twist

<=0.7%

Flammability

94v-0

Application field

Communication productions, computer and its peripherat products, DV products, automotive products, advanced household appliances and electronic instruments ect