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·High Thermal Conductivity
·Low Dielectric Constant
·Low Dielectric Loss
Applications
·Heat Emission for Power Semiconductor Devices and IC
·Tubes and Rods
·Bars, Plate and Blocks
Characteristics of MaterialItem | Unit | Value |
Bulk Density | g/cm3 | 2.9 |
Mohs Hardness |
| 8 |
Thermal Expansion Coefficient | 10-6/°C | 7~8.5 |
Modulus of Elasticity | GPa | 345 |
Flexural Strength | MPa | 205 |
Tensile Strength | MPa | 125 |
Compressive Strength | MPa | 1550 |
Dielectric Constant (at 1MHz) |
| 6.7 |
Dielectric Loss Angle (at 1 MHz) | ×10-4 | 5 |
Dielectric Strength | kV/mm | 10~14 |
Thermal Conductivity (at 25°C) | W/mK | 250 |
Volume Resistivity(at 25°C) | Ωcm | >1014 |