Ads by Google
Laptop NOTEBOOK A770B BGA/CSP Rework Station
Specifications:
| General power: | 2000W |
| Power of top heater: | 700W |
| Power of bottom pre-heater: | 400W*4=1600W(infrared heater) |
| Power of bottom heater: | 800W |
| Temperature range (hot air): | 450°C(max) |
| Temperature range (preheating): | 300°C(max) |
| Speed of side cooling fan: | ≤3.5m3/min |
| Bottom preheating area: | 330mm*360mm |
| Max PCB size: | 330mm*360mm |
| Outside K-type sensor: | 3pcs |
| Communication: | standard RS-232C (connect with the PC) |
| Net weight: | 20.0kg |
| Outer dimensions: | 330(L)×380(W)×440(H)mm |
Usage: 1. For a variety of component rework. Such as: BGA, CHIP, QFP, PLCC and so on. 2. Are widely used in mobile phones, digital cameras, LCD TVs, notebooks, desktop computers and other chip-level repair.
BGA rework station QUICK A770B for motherboard repairing