1.94v0 pcb board 2.8 independent internal bank 3.used gold contact fingers. 4.green oil pcb Specifications: Base material: FR4 Layer coverage: 8 layers Board thickness: 1.6mm Copper thickness: 1oz Surface treatment: immersion gold Impedance: 50 ±5 Ohms 1 to 2 layers via blind 2 to 5 layers via buried Solder mask color: green Applications: computer memory

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	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1-30
Board thickness	0.015" (0.4mm)-0.125" (3.2mm)
Board Thickness Tolerance	± 10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	± 10%
Warpage	0.075%-1.5%
Peelable	0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)	0.005" (0.125mm)
Min Space Width (b)	0.005" (0.125mm)
Min Annular Ring	0.005" (0.125mm)
SMD Pitch (a)	0.012" (0.3mm)
BGA Pitch (b)	0.027" (0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005" (0.125mm)
Soldermask Clearance (b)	0.005" (0.125mm)
Min SMT Pad spacing (c)	0.004" (0.1mm)
Solder Mask Thickness	0.0007" (0.018mm)
Hole size	0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)	± 0.003" (± 0.0762mm)
Aspect Ratio	6: 1
Hole Registration	0.004" (0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au: 1-3u' '
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	± 0.004' ' (± 0.1mm)
Beveling	30° 45°
V-cut	15° 30° 45° 60°
Certificate	ROHS  ISO9001: 2000  TS16949  SGS   UL

Eight-layered Immersion Gold PCB for Computer Memory, Made of FR4 Material, 1.6mm Board Thickness