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semiconductor chip
semiconductor chip
Supplier Info
[China Supplier]
Contact Person : Mr. Lu Ajax
Tel : 86-0-18767053810
Fax : 86-0570-5661170
Product Detail
semiconductor chips are made from semiconductor rods.

Refrigeration principle

The transfer of energy. Of a typical electricity supplier and a P-type N-temperature electric Components into one pair of electricity through the conductor connected story, through direct current, in joints Service will produce strong and energy transfer, call the end decalescence story. the other side Exothermic, when currents from N-P. decalescence-called cold side, exothermic-called hot side. Change the current direction of the cold and hot-swap. Temperature components is electricity. Several of the linked call anyone, and the hot-hot-parallel connection, with the cold-cold parallel connection .connected direct current. the hot-install components in the temperature of heat release devices, Distributed as soon as possible to generate heat off, the cold-smoking on the work environment Heat .which is typical of the basic operating principles of refrigeration components.

The right way to use our product                                                      

1. Voltage current work To improve device reliability, practical work voltage, current work should be less than the maximum voltage devices, the largest current, practical applications in the 127 series of general voltage controlled 12-13V.And the most hot noodles High temperature not exceeding 90 degrees, the electricity supply Wenbo factor less than 10%

2.temperature control Cold and hot noodle temperature changes dramatically reduce device reliability and longevity, it would be desirable to Continuous control voltage or current electricity, polarity cut over(change current direction)will also enable Device reliability and lower life expectancy.

3.radiator The smoking device being heated face radiator heat dissipation of heat capacity and efficiency influence, The choice of hot noodles radiator to be large enough to ensure their ability to heat release, Then in the assembly Area must be evenly doodle with the heat conduction rate Guizhi to minimize4 Rezu .No hot noodles with heat release, not connected power.

4.pressure  Securing devices, device pressure over10kg/cm*cm will be significantly reduced by pieces of reliability. Therefore the installation of devicesa to the surface as possible so that devices are affected by the power Absorbed, the pressure appropriate.

5.conductors Wire towards themselves, red line in right, black lines in the left. Red line with the positive power Linked with cathode joined black line Then in the side to cool.

We obtains many patents in the production process, spurts the nickel technology and Galvanization technology.

Shipping

Shipping usually by UPS/DHL/EMS. only if you have any requirement

If you are interested in our products ,pls  contact  us.

Your inquiry will be responded within 24 hours.

semiconductor chip

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