Pin grid array (PGA) Application This package is equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a

Pin grid array (PGA)

 

ApplicationThis package is equipped with advanced IC chips, such as ASIC, used mainly for the MPU of a computer and communications equipment.

 

MaterialThe main body consists of co-firing multilayer alumina ceramics, and pin terminals made of an alloy of iron, nickel, and cobalt are attached with silver-brazing to the main body.

 

FeaturesThis package, in which there are ultra-fine wiring circuits created based on a ceramic multilayer wiring structure, supports multifunctional electric properties and can create an integrated built-in capacitor. The external terminal is used not only for socket installation but also supports a fine pitch for surface installation. In addition, it can support cases where external terminals with 400 pins or more is needed.

Pin grid array (PGA) ceramic package