Used in manufacturing integrate circuit and some parts of discrete devices. Annual production output: 500,000 pcs Diameter(mm):                       50.4---200Dia.& tolerance(mm):              X±0.5Thickness Variation:               ±5TTV(um):                                ≤5BOW(um):                              ≤30TIR(um):                                  ≤6Primary Flat Length(mm):         22.5±2.5Secondary Flat Length(mm):     11.5±1.5   Chip(edge break):                     ≤0.3MM

CZ monocrystalline silicon polished wafer