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Feature
Low thermal resistance under low pressureLow hardness, good accordance thermal pads for electronicExcellent weather and tempreture resistance thermal pads for electronicExcellent radiation protection and dielectricExcellent chemical and mechanical stabilityLow stress to protect electric element wellInvolve the profession
ASMP, Integrated Chip, Power module, auto electronic products, communications, computer and its accessories
Configuration
1. Cut according to customer’s requirement
2. No application of gum, adhere gum to single or double surface
3. Standard size is 250mm*250mm, can made according to customer’s requirement