Nominal thickness | um | 12 | 18 | 35 | 70 | |
oz | 1/3 | 1/2 | 1 | 2 | ||
Typical properties | Applicable standard | |||||
1.Thicknessby weight | G/m2 | 107 | 151 | 285 | 580 | IPC-4562UIS(6515) |
Tensile strength | IPC-4562UIS(6515) | |||||
2.1 at 23°C | N/MM2 | 400 | 400 | 400 | 350 | |
2.2 at 180°C | 200 | 200 | 200 | 180 | ||
3.Elongation | IPC-4562UIS(6515) | |||||
3.1 at 23°C | % | 8 | 8 | 10 | 15 | |
3.2 at 180°C | 6 | 6 | 6 | 6 | ||
4.untreated side profile | um | 0.25 | 0.25 | 0.25 | 0.25 | |
5.surface treated side profile | um | 5.0 | 6.0 | 9.0 | 13.0 | |
6.Peel strength (by FR-4) | FR-4Tg 140°C | |||||
6.1Condition A | 1.2 | 1.4 | 1.8 | 2.5 | A | |
6.2 After solder float | 1.2 | 1.4 | 1.8 | 2.5 | S4 | |
6.3 After baking | 0.8 | 0.8 | 1.2 | 1.7 | E-48/180 | |
6.4 At elevated temperature | 0.8 | 0.95 | 1.15 | 1.25 | At 125°C | |
6.Peel strength | FR-4Tg170°C | |||||
6.1 Condition A | KN/m | 0.9 | 1.2 | 1.4 | 1.7 | A |
6.2 After solder float | 0.9 | 1.2 | 1.4 | 1.7 | S4 | |
6.3 After baking | 0.8 | 1.0 | 1.2 | 1.4 | E-48/180 | |
6.4 At elevated temperature | 0.8 | 1.0 | 1.2 | 1.4 | At 125°C | |
6.5after boiling test | Degradation rate | <10 | <10 | <10 | <10 | D-2/100 |
6.6 After exposure to HCI Sol | <3 | <3 | <3 | <3 | 18% 25°C 60min | |
7.Solderability | Good | IPC-4562 |
PCB copper foil