Diamond grinding wheel for hard alloy material
High grinding efficiency, slow worn consumption. Good self-sharpness, low heat productivity, not easy to block
Diamond grinding wheel series:
a. Resin Bond Diamond Grinding Wheel
(1) High grinding efficiency, slow worn consumption.
(2) Good self-sharpness, low heat productivity when grinding, not easy to block, phenomenon of burning workpiece reduced.
(3) A certain flexibility improve the surface roughness of workpiece.
(4) Ready for use, various complicated non-standard products available as per customers’ requirements.
b. Vitrified Bond Diamond Grinding Wheel
(1) High strength, good heat resistance.
(2) High wear resistance on grinding hard and brittle workpieces, low abrasive particle consumption.
(3) Low grinding temperature, much longer life than resin bond diamond grinding wheel.
(4) High grinding accuracy, good workpiece surface.
Application fields:
Processing of hard and brittle materials such as PCD cutting tools, PDC, PCBN cutting tools, woodworking cutting tools, optical glass, semiconductor, sapphire, ferrite, ceramic and so on.
Order example:
Model | D(mm) Diameter | T(mm) Thickness | H(mm) aperture | X(mm) Ring width | Abrasive type | Size | Bond | Concentration | Hardness |
1A1 | 400 | 50 | 203 | 10 | D | 120 | B,V | 100 | M |
Diamond grinding wheel for hard alloy material