GRINDING/POLISHING MACHINE

Features:

Precision rotating shaft with running off < 5 micron Two super flat lapping plate with flatness < 0.25 micron / Inch2 one cast iron plate for lapping and one cast aluminum plate for polishing Heavy duty cast aluminum case with bright paintingTwo rocking work stations with wafer holders and condition rings. They can be controlled independently for polishing 2 pcs of  3" wafers in one running Variable speed from 0 to 500 RPM with digital display Adjustable timer for auto-stop up to 99 hours Power: 110 and 220 AC switch-able for worldwide use.  Dimension:  525 L x 350 W x 325 H (mm)Shipping Weight:  120 lb