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Multilayer FPC is more than two layers of copper circuitry with copper plating on the pads.Three or more flexible conductive layers with flexible insulating layers between each one, which are interconnected by way of plated through holes (PTH). Layers range from 1 to 8 layers we can make now.
| Types: | Single-sided, Double-sided, Multi-layers (max 6 layers) fpc board and Rigid PCB, Aluminium board |
| Surface Finishing: | Gold plating, HASL(LF),Electroless nickel immersion gold, Immersion Tin, OSP(Entek) |
| Base Material: | Polyimide(Kapton) |
| Copper Foil: | ED/RA |
| Min. Line Width: | 2 mil |
| Min. Line Spacing: | 2 mil |
| Min. Hole Size: | 0.2mm |
| Max. Board Size: | 250x300mm |
| Min. Board Thickness: | 0.1mm |
| Min. Solder Mask Thickness: | 10um |
| Coverlayer: | Polyimide |
| Profiling: | Punching |
| Soldering Thermal Resistance: | 300°C/10 seconds |
| Peeling Strength: | ≥1.4kg/cm |
| Surface Resistance: | 105mΩ |
| Insulation Resistance: | 105mΩ |
| Dielectric Strength: | 9.8x105v/cm |
| Flammability: | UL-94V-0 |
| Performance Test: | 100% electrical and electricity performance test |
Multilayer FPC