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0.6mm finished Printed Circuit Board
0.6mm finished Printed Circuit Board
Supplier Info
[China Supplier]
Contact Person : Mr. Chen Jim
Tel : 86-755-86229529
Fax : 86-755-26073349
Product Detail
10 layer, 0.6mm finished board thickness ENIG Au: 2-2.9u'' Ni: 100-150u'' Min width/space: 0.19mm/0.19mm

Available surface finish _ Flash Gold / Hard Gold Plating / Immersion Nickel / Gold / Silver/ Tin Hot Air Solder Leveling / HAL Lead-Free / Selective Plating / Entek Coating (OSP) / Milling Process / V-Cut Process / Gold Finger Process / Peelable Mask / Carbon Ink Printing Engineering capability Positioning: + / - mm + / - inches 1. Hole or center position tolerance: 0.050 0.002 2. Pattern registration with outline: 0.076 0.003 3. Punching shift with outline: 0.150 0.006 4. Min. Clearance between Holes and outline Equal to Board Thickness Hole size Tolerance: + / - mm + / - inches 1. Minimum Finished Hole size 0.300 0.014 2. Maximum drill size: 6.500 0.256 3. Maximum Aspect Ratio:4 4. Hole size tolerance (PTH) 0.075 0.003 (NPTH) 0.050 0.002 5. Drill hole to drill hole pitch tolerance (t < 0.6 mm): 0.075 0.003 Outline Tolerance: + / - mm + / - inches 1. Punched Outline Dimension: 0.150 0.006 2. Routed outline Dimension: 0.130 0.005 Plating Tolerance 1. Minimum PTH thickness: 3 um 2. Minimum Gold thickness: 0.03 um 3. Minimum Nickel thickness:3 um 4. Max. Cu THK. : 28 um 5. Max. Ni THK. : 10 um 6. Max. Au THK. : 3 um 7. Hot Air solder levelling 2 - 38 um Solder Mask: + / - mm + / - inches 1. Minimum Opening:0.10 0.005 2. Minimum trace: 0.08 3. Min. Trace between pads 0.20 4. Registration tolerance 0.10 5. Mask thickness on bare base material 0.7 to 1.2 mil pads 0.6 to 1.0 mil traces 0.2 to 0.5 mil V - Cutting (scoring) Board shape must have at least 2 parallel lines for V-score! 1. Min. Remaining thickness:for FR4 0.3+/-0.1 for CEM3 or CEM 1 0.5+/-0.1 Inner Layers: + / - mm + / - inches 1. Min. Annualar ring:0.01 0.0005 2. Min. Line width: 0.12 0.0050 3. Min. Spacing: 0.13 0.0050 4. Registration tolerance +/-0.13 +/-. 005 CMOS Cavity Requirements 1. Remain THK. Of the Cavity +/- 0.05 2. Dimension of Cavity +/- 0.15 3. Location of Cavity:+/- 0.15 Panel Size Maximum Panel Size:18 " X 24" Maximum Circuit Size:17" X 22" : + / - mm + / - inches 2. Location tolerance: +/-0.2 3. Maximum board size for V-cut 15.25" 4. Min. Board size for V-cut:4" 5. Min. THK. Requirement for V-cut 0.6 mm 6. Angle available to choose 30 and 45 degree 7. V-cut to outline tolerance:+/- 0.15 Chamfering 1. Tolerance: +/-0.15mm 2. Angles in bevelling 45 & 60 Angular tolerance For board THK. = or < 0.6mm's outline +/- 0.5 degree

About us

Fumax - Your Best Reliable Manufacturing Partner in China!

We are a leading Contract Manufacturing Service provider in Shenzhen China. We provide excellent Turnkey project service for worldwide customers. Our factory has over 800 staff with a group of experienced mechanical & Electronic engineers. We are able to manufacture products starting from initial product design, Electronic circuit Design, PCB Layout, Components Sourcing & Purchasing, Plastic/Metal mechanical design, Mold / Tooling design & fabrication, sub-assembly, full assembly to final product testing / package.

1. Our specialized design and engineering teams can tailor products to meet your specific needs. We employ more than 500 highly qualified skilled workers, with manufacturing facility covering a total area of 35,000sqm.

2.From China manufacturing and OEM/ODM base in Shenzhen, Fumax serves as a global partner to worldwide customers.

3.Our dedication to cutting-edge technology, product excellence, consistent quality, competitive pricing, unsurpassed service and customer satisfaction has brought us outstanding recognition in these industries.

Our companys manufacturing capability:

(1)  For SMT placement: we place big quantity SMD components per day.

(2)  For manual assembly: we have more about 800 workers in 2 factories, and are able to manually assemble full products 60K per day.

(3)  We have 4 SunEast Reflow ovens with ROHS and UL compatibility.

(4).Our EMS services include:

Project evaluation and cost analysis ,Component

procurement and testing

Prototype and pilot running

Mass production and engineering tests

Plastic injection, metal die casting, and all kinds of metal process

Wire harness

Shipment and post-sale support

(5)Our design service:    Circuit design and PCB layout    System integration and architecture     Mechanical design and wire harness     Firmware and software programming     Microprocessor technology and electronic construction

Our product building experience range: industrial, automotive, storage, consumer, instrumentation, medical, networking, peripherals, telecommunications, and more

Other Service:

(1)Our company can provide RHOS, CE, FCC, UL. Certificates for all our exported products.

(2)Our company has software and hardware engineers who can help our customers to design, change, or improve their products.

(3)Our company has technicians, product engineers, and quality control team to provide after-sale service for our customers.

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