Max. cross-section of workpiece 220×220mm
Max. length of workpiece 820mm
Min. thickness of chip 0.1mm
Max. working stroke 300mm
feeding speed of workpiece 0~10mm/min
speed of rapid approach and withdrawal 300mm/min
the diameter of cutting wire 0.1~0.16mm
the tension of steel wire 10~35N
the diameter of home roll φ320mm
Max. cutting linear velocity 15m/s
the capacity of abrasive slurry tank 360L
resolution of feeding axis 0.001
total power capacity 150KVA
overall dimension 4040×2600×3650mm
total weight of the machine 18T
HJMT Multiwire Silicon Cutting Machine for the photovoltaic industry