Average particle size(um)is 2 Specific surface area(m 2 / g)is 3.18 Bulk density(g / cm 3) is 4.35 Polymorphs is Quartet

The main features

 Micro indium powder production process of the DC arc plasma evaporation method, high purity, uniform particle size, easily dispersed, high surface activity, can be used in the semiconductor, high-purity alloys, and silicon solar cell back surface field aluminum paste (silver, aluminum, pulp, etc.) antistatic materials; micro indium powder can be used as additives Antistatic transparent coating and surface materials to use; micro indium powder with antistatic, transparent and abrasion and scratches, excellent performance, is a new generation of electronic packaging materials, flat ideal platform to display, clean indoor surface materials add material; micro-indium material with conductive properties, this feature also allows it to become the future of photovoltaic cells (solar cells), an excellent raw material of the medical device and biotechnology imaging products.

 Applications

1 An electronic slurry, to reduce the sintering temperature of electronic slurry; 2 for the solder alloy, the lower the melting point of the alloy; 3Used in alloys to improve the wear ability of the alloy; 4 For lubricants to improve the wear ability of the lubricating oil;

 5 application of coatings to improve the transparency and abrasion resistance, scratch resistance, electrical conductivity and other capacity;

Micro Indium powder In