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Application: This item is used for SMD packing and transformer manufacturing. Can be used for die cutting
Specification: 1. Polyimide base film coating with high temperature Silicone adhesive. One side with Fluorine release film
2. High temperature and corrosion resistance;
3. Strong adhesion;
4. Soft and proper and no residue after peeling off.
5. For electronic manufacturing industry.
PI adhesive tape with Fluorine release liner