1.Metallized Ceramic Substrate by Laser cutting 2.Good corrosion and wear resistance 3.Good heat conductivity, fire resistan

Features:

1.Special types are available according to customer's drawings or samples

2.Various size to very tight dimensional tolerances.

3.Excellent mechanical, electrical and thermal characteristics.

4.Various sizes and pattern design,Excellent bonding strength.

Regular thickness:

0.25mm,0.28mm,0.45mm,0.5mm,0.635mm,1.0mm,1.5mm,  1.8mm, 2.0mm

Metallization:

The surface can be covered a lay of metallization,such as Ag, Pd-Ag,Mo-Mn, Ni-plating with good tensile strength: Mo-Mn thickness: 25~40μm,Ni thickness:3~7μm, Tensile strength≥120MPa

Metallization Materials:

Ceramic + Mo/Mn Metallized + plating NiCeramic + Mo/Mn Metallized + plating AgCeramic + Mo/Mn Metallized + plating AuCeramic + printing Ag

Application: 

widely used in thick film circuits large-scale integrated circuits, hybrid ic, semiconductor packages, chip resistors, networks resistor , focusing potentiometer, power modules, power hybrid circuits and other related fields of electronic industry 

Metallized Alumina Ceramic Substrate