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Circuit Board Technical Specification of leadsintec  Technology Ltd
Item		Parameter
		Double sided	Multilayer
Number of Layers		2	1-22
Copper Thickness		0.25~3.0OZ	0.5~3.0OZ
Base Board Thickness		0.3~3.2mm	0.6~7.0mm
Incombustibility		94V-0	94V-0
Peelable resistance		12.3N/cm	12.3N/cm
Twist		≤0.5%	≤0.5%
Insulation resistance		≥1011Ω	≥1011Ω
Test voltage		10-300V	10-300V
Finished board area		560×970mm	560×970mm
Min. Line Width and Spacing		0.1/0.1mm	0.1/0.1mm
Copper thickness in hole		≥25.0um	≥25.0um
Mini. pad diameter	Inner layer		0.05mm
	Out layer	0.076mm	0.076mm
Mini. Hole Diameter		0.25mm	0.20mm
Hole tolerance	PTH	±0.076mm	±0.076mm
	NPTH	±0.05mm	±0.05mm
Hole location tolerance		±0.076mm	±0.05mm
profile tolerance	Routing	±0.1mm	±0.1mm
	Punching	±0.13mm	±0.13mm
Solder mask bridge ability		≥0.1mm	≥0.075mm
Solder mask rigidity		6H	6H
Solderable test		245 ºC     5 second	245ºC     5 second
Thermal cycling ability		288ºC    10 second	288ºC   10 second
Surface Finishing		OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger	OSP, HAL, Immersion gold , Gold

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