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Laboratorial Reflow oven-PCB equipment
Laboratorial Reflow oven-PCB equipment
Supplier Info
[China Supplier]
Contact Person : Mr. Zol Sun
Tel : 86-10-67566879
Fax : 86-10-61232561
Product Detail
This machine is for chip mountering application,small quantity or laboratories uses.

GE-T35 Laboratorial Reflow oven-PCB equipment

Feature:1. Applied RS232 communication interface, convenient for monitoring the running status.2. The inner container of the Oven adopts (Compared with common reflow soldering) 8K Mirror stainless steel material, Use reflection principle to make the furnace temperature more even.3. Totally enclosed design, with high efficiency thermal insulation material and efficient sealing strip, heat preservation effect is good, heat resisting and corrosion resistance, easy to clean, power saving.4. Special exhaust channel control emissions, friendly environmentally. (optional Gas filtration unit).5. Heating pipe effective heating length is up to 360 mm.6. The drawer PCB board placed frame, steady, large space, suitable for placement of different size and shape PCB board.7. It can be used for soldering CHIP, SOP, QFP, BGAetc.8. High efficiency, a welder and a fingerprint table eight hours can produce more than 100 pieces (each piece of 100 element), the small size of the PCB can amount to thousands of tablet.9. Small volume, light weight, can be put on desk, the operation is simple to learn.10. The visualization of welding process, is the best choice of teaching research.11. Unique hot air circulation duct make the furnace inside temperature more uniform, and the welding effect is better.12. Unique cooling air duct make the cooling speed to meet welding curve cooling requirements (general decline 1 ~ 3 degrees/S), equiped with emissions interface.

Parameter:

Model: GE-T35Transmission: DrawerPCB bearing plate: High temperature resistant nonopaque trayWorkpiece allowed height: 0± 5mmWorking table size: 350× 250mmControl system: PID+computer controlCommunication mode: RS23Temperature zone: Single zone several temperature segmentsTemperature segments: 1~128segmentsTemperature Control Mode: Microcomputer automatic control temperature, SSR contactless outputTemperature control: Max300centigrade degree, thermostability, Suitable for high temperature solderingHeating mode: Infrared + hot air convectionTemperature curve: Can set 1~8 temperature curves, each curve controlled with 16 segments.Teperature control accuracy: ± 1centigrade degreeFurnace material: 8k mirror stainless steel materialHeating pipe length: 360mmCooling Mode: Built-in compressor type cold wind coolingTemperature drop slope: 1~4centigrade degree/secCooling air duct: Independent exhaust air duct, standard outlay exhaust interfaceDimension: 620*460*385mmRated voltage: ACsingle phase, 220V, 50HzPower rating: 4.2kwAverage power: 1.2kwWeight: 50kgOutlay exhaust interface diameter: 90mm

Laboratorial Reflow oven-PCB equipment

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