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high performance polyimide resin
I. Products brief introduction
TY005-1 polyimide resin is a kind of matrix resin of advanced composite materials which is widely used in high-performance materials ‘ manufacturing filed and especially use it to produce duplicate copper plate and laminates CCL with high resistance of temperature etc. it can replace Kerimid 701A polyimide resin.
II. Chemical desc ription
It is bismaleimide-based polyimide resin system and has no DDM in its components which meets the environmental protection requirements.
III. Features
.High vitrification transition temperature and thermal stability property
. Excellent solvent resistance
. Low coefficient of thermal expansion (CTE,T-axis)
. Copper Foil high peel strength
. Good storage stability
IV. The use of products
According to the requirements of the solid content that used, use organic solvents such as acetone for diluting.
When produce CCL by pure resin, should dilute the pure resin with solvent to 40-65% of solid content under the condition of below 80°C.
When produce CCL by mixing TY005-1 polyimide resin and brominated epoxy resin, the content of brominated epoxy should under 20% when the resin is pure, and appropriate amount of inorganic flame retardantsAL(OH)3should also need. Under the condition of diluting the pure resin with solvent to 40-65% of solid content below 80°C.
Use reinforced fiber (glass fiber, carbon fiber, etc.)to produce prepreg material for laminated products using.
V. The ultimate performance indicators
Vitrification transition temperature (T g) °C
Flame retardant (U L-94)HB/V1/V0
Copper foil peel strength (ibs./ in.)≥7
Mechanical property, thermal stability property and electrical property can be comparable with kerimid 701A
Quality indicator
Appearance | Solid content (%) | Gel time ( seconds . 171°C |
Reddish brown viscous liquid | 40-80 | 200-600 |
high performance polyimide resin