... .3kv/mm15S/M abrasion>6H16Thermal stress288°C 10Sec17Test Voltage50-300V18Min. blind/buried via0.15mm (6mil)19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating ... , Plating gold20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base 4 layer sided cell phone pcb design and copy service