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Semiconductor discrete components case (shell) A3,B3D,To-46 series
Semiconductor discrete components case (shell) A3,B3D,To-46 series
Supplier Info
[China Supplier]
Contact Person : Ms. w Janet
Tel : 86-028-85980522
Fax : 86-082-85980520
Product Detail
1 GB1804-2000 m level of dimensional tolerances 2 Small size light weigh high integration 3 process maturity

This series of shell is early transistors shell having characteristics of a small size, light weight and the process of maturity, which would ensure long-term stability of semiconductor chips with high reliability.

In material selection, the shell of metal materials can use 4J29 (Kovar) iron-nickel-cobalt alloy, 4J42 and 4J50 iron-nickel alloy, 10 # steel and other metal materials. The melt seal material can choose molybdenum group of glass and steel group glass as the insulation material. Ag72Cu28 brazing material is major welding materials.

Dimensional tolerances of the shell adopt generally according to the GB1804-2000 M level in addition to special requirements.

The surface of the shell plating coating is available upon request gold-plated, nickel plated and partial plate.Internal and external lead length of the shell can be determined according to user requirements.Above all, the type can be designed and produced according to user requirements.

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