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1. FR4+PI material2. 2L 1oz copper, Board Thickness0.2 mm3. Competitive price with good quality
4. FR4 stiffener thickness is 0.2mm
5. Certificate: ROHS, UL, ISO9001-2000, ISO14001
Our Manufacturing Capability for PCB Board
Material type: Ployimide ( PI ), Ployester (PET), FR4
Surface Treatment: immersion gold,OSP, immersion tin, plating gold
Board Panel Size: 400mm*610mm
Board Layer: 1L-4L
Board thickness: 0.1mm to 0.25mm
Finished Copper thickness: 1/3 OZ to 2OZ
items | technical index |
Product model | al substrate cu substrate |
material thermal conductivity | 1.0/m.k, 1.5/m.k, 2.0/m.k, 3.0/m.k |
thermal impedance | 0.85 °C/W – 0.4 °C/W |
al base material type | 1060 / 5050 / 5052 |
surface disposal | HASL/ OSP/ immersion gold/ immersion tin/ immersion silver |
layer | Single-side al substrate / double-side al substrate /four-layer al substrte |
maximum measurement | 1200mm*460mm |
minimum measurement | 5mm*5mm |
line width/space | 0.1mm |
warp and twist | ≤0.5%(thickness:1.6mm, measurement:300mm×300mm) |
processing thickness | 0.3-5.0mm |
copper foil thickness | 35um 70um 105um 140um |
molding dimension tolerance | ±0.15mm |
v-cut positioning accuracy | ±0.1mm |
aperture location deviation | ±0.076mm |
scope of molding dimension tolerance | cnc:±0.1mm punching:±0.15mm |
breakdown voltage | 3KV - 5KV |
peel strength | ≥1.4N/mm |
0.2mm double side flex rigid connector pcb board