1.94v0 pcb board 2.8 independent internal bank 3.used gold contact fingers. 4.green oil pcb Specifications: Base materials: FR4, CEM-1/3 and aluminum Layers: 1 to 20 Temperature (Tg): 135, 150 and 170°C Board thickness: 0.2 to 3.2mm Tolerance of thickness: ±10% Minimum finished hold size Drilling: Mechanical: 0.2mm Laser: 0.05mmBase copper weight: Minimum: 12μm (1/3oz) Maximum: 70μm for inner and 140μm (4oz) outer layer

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	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1-30
Board thickness	0.015" (0.4mm)-0.125" (3.2mm)
Board Thickness Tolerance	± 10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	± 10%
Warpage	0.075%-1.5%
Peelable	0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)	0.005" (0.125mm)
Min Space Width (b)	0.005" (0.125mm)
Min Annular Ring	0.005" (0.125mm)
SMD Pitch (a)	0.012" (0.3mm)
BGA Pitch (b)	0.027" (0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005" (0.125mm)
Soldermask Clearance (b)	0.005" (0.125mm)
Min SMT Pad spacing (c)	0.004" (0.1mm)
Solder Mask Thickness	0.0007" (0.018mm)
Hole size	0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)	± 0.003" (± 0.0762mm)
Aspect Ratio	6: 1
Hole Registration	0.004" (0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au: 1-3u' '
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	± 0.004' ' (± 0.1mm)
Beveling	30° 45°
V-cut	15° 30° 45° 60°
Certificate	ROHS  ISO9001: 2000  TS16949  SGS   UL

6L PCB with Gold Finger for Desk Computer Memory Card, Made of FR4, CEM-1/3 and Aluminum