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99% Ceramic Electrical Alumina Plate Substrate Heatsink Plate Metallized With Gold,Silver,Copper,Ni,Mn Etc.For Electronic Applications!Customized Designs!Min Thickness 0.1mm!
It has the features of high reliability,high density power,high thermal conductivity,high insulation and cycling performance.Dimensions can be formed be mould stamping or laser cutting,is used in thick film circuit,large-scale integrated circuit,hybrid IC,semiconductor package,chip resistor and other electronic industry fields.
Technical Data:
Items | Unit | 95%Al2O3 | 99.5%Al2O3 |
Density | g/cm3 | 3.7 | 3.9 |
Flexural Strength | MPa | 313 | 340 |
Compressive Strength | MPa | 3400 | 3600 |
Modulus of Elasticity | GPa | 350 | 380 |
Impact Resistance | MPa·m1/2 | 4 | 5.1 |
Weibull Modulus | m | 10 | 10 |
Vickers Hardness | HV0.5 | 1800 | 1900 |
Thermal Conductivity | W/mk | 24 | 27 |
Highest Application Temperature | °C | 1600 | 1750 |
Volume Resistivity at 20°C | Ω.cm20 | >1014 | >1014 |
Dielertric strength | KV/mm | 20 | 25 |
Thermal expansion | X10-6/K | 5.0-8.3 | 5.4-8.3 |
Our Products Serials:
99% Ceramic Al2O3 Alumina Plate Substrate For Electroic & Electrical Applications