1.Good solubility 2.Stable chemical property 3.Easily controlling cutting temperature 4. Reducing processing cost by recycle

 Silicon wafer cutting fluids 

Quality specification 

Item	Technical specification
	KLSI-I	KLSI-II	KLSI-III
Appearance	Colorless clear liquid	Colorless clear liquid	Colorless clear liquid
viscosity40	20-24	24-28	28-32
colorAPHA	≤50	≤50	≤50
Relative density g/cm320	1.120-1.130	1.120-1.130	1.120-1.130
Water content%	≤0.3	≤0.3	≤0.3
PH5%aq.solution	5.5-7	5.5-7	5.5-7
Refractive index 20	1.461-1.467	1.461-1.467	1.461-1.467
Heavy metal content (ppm)	≤28	≤28	≤28

characteristics:

    Non-toxic,  no special odor & non volatile 

    stable chemical property,good solubility

    Good compatibility with abrasive powder

    Great dispersion, good suspension on abrasive powder &good heat conductivity

    Easily controlling cutting temperature 

    Easily cleaning the surface of silicon wafer

    Reducing processing cost by recycle& increasing product yield

Usage:

Mainly used in solar energy and semiconductor industries.After mixing cutting fluids with abrasive powder by certain proportion,stirring well at least 8hrs,then used in cutting machine circularly.

Packing :  IBC Tank

silicon wafer cutting fluids (KLSI-I)